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Union Minister Ashwini Vaishnaw announced that the New Electronics Component Manufacturing Scheme, recently approved by the Cabinet, will deepen India’s participation in global electronics value chains. Speaking at VVDN Technologiesâ€� Global Innovation Park in Manesar, Haryana, he emphasised that the scheme will support passive components, complementing the National Semiconductor Mission which already covers active components—thereby creating a complete ecosystem for self-reliant electronics manufacturing. Vaishnaw highlighted India's rapid growth in the sector, with electronics manufacturing growing fivefold in six years to cross Rs 11 trillion and exports surging to Rs 3.25 trillion. He credited this as one of the biggest success stories of the ‘Make in Indiaâ€� initiative, noting the sector now employs over 2.5 million people. The Minister inaugurated VVDN’s largest Surface Mount Technology (SMT) Line capable of placing 250,000 components per hour and supporting large PCBs. Alongside, he opened a 150,000 sq. ft. Mechanical Innovation Park featuring CNC, EDM, injection molding, and tool-making infrastructure. Together, these facilities will generate over 3,000 new jobs, supporting India’s high-tech skilling goals. Vaishnaw lauded VVDN’s design-led manufacturing model, its 5,000-strong engineering team, and in-house development of AI-embedded systems, servers, and 5G products. He stressed India’s edge in design innovation, indigenous development of design tools, and commitment to a trusted, IP-protected electronics base. He also outlined a three-tier skilling strategy, ranging from basic training to advanced, product-specific, and university-level industry-aligned courses. The launch underscores India’s ambition to become a global electronics powerhouse through policy push, talent development, and public-private collaboration. (PIB)